| Optical system | Optical camera | 5 million high-speed intelligent digital industrial camera |
| Resolution (FOV) | Standard 15μm/Pixel (corresponding FOV: 38mm*30mm) 10/15/20μm/Pixel (optional) |
| Optical lens | 5M pixel level telecentric lens, depth of field: 8mm-10mm |
| Light source system | High brightness RGB coaxial ring multi-angle LED light source |
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| Hardware Configuration | Operating system | Windows 10 Professional |
| Computer Configuration | i3CPU, 8G GPU graphics card, 16G memory, 120G solid state drive, 1TB mechanical hard drive |
| machine power | AC 220 volts ±10%, frequency 50/60Hz, rated power 1.2KW |
| Machine size | 1100mm×900mm×1350mm (L × W × H) height including feet |
| Machine weight | 450kg |
| Optional configuration | Off-line programming software, external barcode gun MES traceability system interface is open |
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| Detect PCB specifications | Size | 40×40mm ~450×330mm (larger size can be customized according to customer requirements) |
| thickness | 0.3mm ~6mm |
| Board weight | ≤3KG |
| Clear height | Upper net height ≤ 35mm, lower net height ≤ 70mm (special requirements can be customized) |
| Minimum test element | 0201 components, 0.3 mm pitch and above IC (optional can reach 01005 components) |
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| Test items | Solder paste printing | Presence, deflection, less tin, more tin, open circuit, pollution, tin connection, etc. |
| Part Defect | Missing parts, shifting, skewing, tombstones, standing sideways, overturned parts, reversed polarity, wrong parts, damaged parts, multiple parts, etc. |
| Solder joint defects | Less tin, more tin, even tin, virtual soldering, multiple pieces, etc. |
| Wave Soldering Inspection | Insert pin, no tin, less tin, more tin, virtual soldering, tin bead, tin hole, open circuit, multiple pieces, etc. |
| Red plastic board detection | Missing parts, shifting, skewing, tombstones, standing sideways, overturned parts, reversed polarity, wrong parts, damage, overflowing glue, multiple parts, etc. |
